Tessolve, a global leader in silicon-to-system engineering solutions for smart and connected products, has joined the eSync Alliance, a non-profit trade association driving standardization for Over-the-Air (OTA) updates and data gathering in automotive electronics. This partnership strengthens Tessolve’s connected vehicle offerings, including the Tessolve Edge HPC gateway (TERA), TCU cluster, and onboard diagnostic solutions for OEMs and Tier-1 suppliers.
The collaboration aims to accelerate time-to-market for connected systems through standardized, interoperable solutions, ensuring compliance with evolving cybersecurity and regulatory standards. Tessolve’s expertise complements eSync Alliance’s three-tier server-client-agent architecture, enabling seamless integration across vehicle layers—from embedded systems and ECUs to cloud services.
“Our partnership with the eSync Alliance enhances our ability to deliver secure OTA updates and diagnostic frameworks across the connected vehicle ecosystem,” said Srini Chinamilli, Co-founder & CEO, Tessolve. “By integrating Tessolve’s engineering capabilities with our TERA Edge HPC gateway, clusters, and diagnostic platforms, we are accelerating scalable, future-ready architectures for intelligent mobility.”
Mike Gardner, Executive Director, eSync Alliance, added, “Tessolve’s end-to-end expertise in embedded systems, product engineering, post-silicon validation, chiplets, cybersecurity, and hardware design will help us advance secure, standardized data pipelines across the connected vehicle ecosystem. We’re thrilled to welcome Tessolve to the Alliance and look forward to driving innovation together.”
As vehicles increasingly transition to software-defined platforms, this collaboration reinforces Tessolve’s commitment to delivering intelligent, secure, and globally deployable solutions for the future of mobility.
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